Underfill Encapsulants

Raise board level reliability for high reliability applications

Zymet's high reliability underfill encapsulants both ruggedize and enhance board level reliability. Their thermomechanical properties make them suited for enterprise, automotive, and other harsh environment applications. At the same time, they are high speed underfills that offer unsurpassed flow and cure speeds, making them the preferred choice amongst those working with very large packages, including POP's, BGA's and FO-WLP's.

Features include:

  • High Tg's
  • Low CTE's
  • Low viscosity
  • Fast cures
  • Excellent adhesion to organic substrates
  • Excellent fracture toughness

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