Reworkable Underfill Encapsulants

Ruggedize and raise board level reliability

Ordinarily, area array packages such as BGA’s, CSP’s, and WL-CSP’s are not underfilled. They are surface mount components that are expected to survive industry standard stress tests, such as thermal cycling, HAST, pressure cooker, etc. However, these packages are not designed to survive drop and bend and twist tests or shock and vibration tests. Zymet offers underfill encapsulants to enhance the board level reliability of these area array packages in harsh environments.

Features include:

  • Reworkability
  • Dispensable with low cost pneumatic dispensers
  • Fast flow into fine gaps, as small as 6 microns
  • Fast flow under large BGA's, 50 mm or larger
  • Fast inline curing, in as little as 60 seconds
  • Low CTE available for enhanced thermal cycle performance
  • Long pot life

For more information about specific applications and products, please Contact Us.