Ordinarily, area array packages such as BGA’s, CSP’s, and WL-CSP’s are not underfilled. They are surface mount components that are expected to survive industry standard stress tests, such as thermal cycling, HAST, pressure cooker, etc. However, these packages are not designed to survive drop and bend and twist tests or shock and vibration tests. Zymet offers underfill encapsulants to enhance the board level reliability of these area array packages in harsh environments.
Features include:
Reworkability
Dispensable with low cost pneumatic dispensers
Fast flow into fine gaps, as small as 6 microns
Fast flow under large BGA's, 50 mm or larger
Fast inline curing, in as little as 60 seconds
Low CTE available for enhanced thermal cycle
performance
Long pot life
For more information about specific applications
and products, please Contact Us.
