Zymet product



Reworkable Edgebond Adhesives
Ruggedize and raise board level reliability

Anisotropically Conductive Adhesives
Electrically interconnect and ground

Electrically Conductive Adhesives
Die attach and general electronics assembly

Thermally Conductive Adhesives
Dissipate heat

Non-Conductive Pastes (NCP)
Attach RFID and smartcard flip chip IC’s

Optoelectronics Adhesives
Assemble optical fiber, connectors, ferrules, VCSEL and Bragg Grating

Ultra-Low Stress Adhesives
Bond stress sensitive devices


Underfill Encapsulants
Raise board level reliability for high reliability applications

Reworkable Underfill Encapsulants
Ruggedize and raise board level reliability

UV Curable Glob Top and Dam-and-Fill Encapsulants
Encapsulate wirebonded IC’s