ZYMET PRODUCTS
Adhesives
Ruggedize and raise board level reliability
Anisotropically
Conductive Adhesives
Electrically interconnect and ground
Electrically Conductive Adhesives
Die attach and general electronics assembly
Thermally Conductive Adhesives
Dissipate heat
Non-Conductive Pastes (NCP)
Attach RFID and smartcard flip chip IC’s
Optoelectronics
Adhesives
Assemble optical fiber, connectors, ferrules, VCSEL and Bragg Grating
Ultra-Low Stress
Adhesives
Bond stress sensitive devices
Encapsulants
Underfill Encapsulants
Raise board level reliability for high reliability applications
Reworkable
Underfill Encapsulants
Ruggedize and raise board level reliability
UV Curable Glob Top
and Dam-and-Fill Encapsulants
Encapsulate wirebonded IC’s