Zymet Products


Reworkable Edgebond Adhesives
To ruggedize electronics for harsh environments and to enhance thermal cycle performance

Anisotropically Conductive Adhesives
For flip chip attachment or electrical grounding

Electrically Conductive Adhesives
For die attach and general electronics assembly

Thermally Conductive Adhesives
For heat dissipation

Non-Conductive Pastes (NCPs)

For flip chip attachment of RFID and smartcard IC's

Optoelectronics Adhesives
For applications such as fiber assembly, connector or ferrule assembly, VCSEL assembly, Bragg Grating assembly, and many others.

Ultra-Low Stress Adhesives
For bonding of stress sensitive devices



Underfill Encapsulants
To enhance the thermal cycle performance of flip chips

Reworkable Underfill Encapsulants
Enhance the board level reliability of these area array packages in harsh environments

UV Curable Glob Top and Dam-and-Fill Encapsulants
To permit the use of low cost substrates that cannot tolerate exposure to high temperatures

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