Reworkable Underfill Encapsulants
for BGA's, CSP's, and WL-CSP's
Ordinarily, area array packages such as BGA’s, CSP’s, and WL-CSP’s are not underfilled.
They are surface mount components that are expected
to survive industry standard stress tests, such as
thermal cycling, HAST, pressure cooker, etc. However,
these packages are not designed to survive drop and
bend and twist tests or shock and vibration tests.
Zymet offers underfill encapsulants to enhance the
board level reliability of these area array packages
in harsh environments.
Dispensable with low cost pneumatic dispensers
Fast flow into fine gaps, as small as 6 microns
Fast flow under large BGA's, 50 mm or larger
Fast inline curing, in as little as 60 seconds
Low CTE available for enhanced thermal cycle