Underfill Encapsulants

Reworkable Underfill Encapsulants
for BGA's, CSP's, and WL-CSP's

Ordinarily, area array packages such as BGA’s, CSP’s, and WL-CSP’s are not underfilled. They are surface mount components that are expected to survive industry standard stress tests, such as thermal cycling, HAST, pressure cooker, etc. However, these packages are not designed to survive drop and bend and twist tests or shock and vibration tests. Zymet offers underfill encapsulants to enhance the board level reliability of these area array packages in harsh environments.

Features include:

  • Reworkability (view example)
  • Dispensable with low cost pneumatic dispensers
  • Fast flow into fine gaps, as small as 6 microns
  • Fast flow under large BGA's, 50 mm or larger
  • Fast inline curing, in as little as 60 seconds
  • Low CTE available for enhanced thermal cycle performance
  • Long pot life

Links to References

  1. Process Benefits of Underfill Encapsulants for CSP's and BGA's BY KARL LOH AND EDWARD IBE (SMT Magazine)

  2. Preventing Voids in CSP and BGA Underfil Encapsulants (Circuits Assembly)

  3. Reliability Effects of Unfilled Underfill BY KARL LOH AND EDWARD IBE (SMT Magazine)

  4. Underfill Effects on BGA Drop, Bend, and Thermal Cycle Tests BY EDWARD IBE, KARL LOH, JING-EN LUAN, AND TONG YAN TEE (Advanced Packaging Magazine)

 

 

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