News and New Products

A New Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP

A new reworkable edgebond adhesive from Zymet has been shown to enhance the board-level reliability of a large wafer-level chip-scale package (WLCSP). The work was performed in a collaborative effort between Portland State University, Cisco, and Zymet, and published in the Proceedings of the SMTA International 2016 conference, which took place in Rosemont, IL.

Reworkable Edgebond Adhesive Dramatically Enhances Board Level Reliability of Area Array Packages

A new approach to enhancing the board level reliability of area array packages was presented at the recent SMTA International...

Reworkable Underfill Enhances Board Level Thermal Cycling of IC Packages, Zymet CN-1735

Zymet has introduced a new reworkable low-CTE underfill encapsulant, CN-1735, designed to enhance the board level thermal cycle performance of IC packages with pitches as fine as 0.3- mm pitch.

Zymet Announces Highly Crack Resistant Underfill for Thin, Flexible Assemblies, CN-1751-4

Zymet has introduced a new reworkable underfill encapsulant, CN-1751-4...

Zymet Announces Reworkable Underfill for 0.4-mm Pitch POP's

Zymet has introduced a new reworkable underfill encapsulant, CN-1736...

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs...

Reworkable Underfill for Package-on-Package (POP)

Zymet has introduced a new reworkable underfill encapsulant, CN-1728....

Reworkable Underfill Encapsulant for BGAs and CSPs

Zymet has introduced a new reworkable underfill encapsulant, CN-1703, designed for CSP and BGA encapsulation...

Underfill Encapsulant for BGAs, CSPs and WL-CSPs

Zymet has introduced a new underfill encapsulant, CSP-1412, designed for BGA, CSP, and WL-CSP encapsulation...

Reworkable Underfill Encapsulant for BGAs

Zymet has introduced a new reworkable BGA underfill encapsulant, CN-1453...

Ultra-Low Stress Die Attach Adhesive for Stress Sensitive Devices

Zymet is offering an ultra-low stress die attach adhesive, TC-601.1, uniquely suited for bonding of stress sensitive devices...

UV Curable Encapsulant for High Reliability IC Encapsulation

Zymet has introduced a high reliability UV curable encapsulant for IC encapsulation...

UV Curable Cavity-fill Encapsulant for High Reliability IC Encapsulation

Zymet has introduced a high reliability UV curable encapsulant for cavity-fill IC encapsulation....

Fast Flow Underfill Encapsulant for CSPs and BGAs

Zymet has developed a fast flow underfill encapsulant, designated X6-82-5LV...