Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly. Its adhesives include electrically conductive adhesives, thermally conductive adhesives, anisotropically conductive adhesives, ultra-low stress adhesives, and optoelectronics adhesives. Its encapsulants include UV curable glob top encapsulants, dam-and-fill encapsulants, and underfill encapsulants. Its underfill encapsulants include flip chip encapsulants and reworkable CSP and BGA encapsulants.
Through its worldwide network of sales agents and stocking facilities, it serves customers in North and South America, Europe, and Asia. Zymet counts amongst its customers world-class multinational companies that are leaders in their industries. Customers include manufacturers of handheld and consumer electronics, computers, storage devices, automotive electronics, medical electronics, and military electronics.
Manufacturing & Quality
Zymet's manufacturing utilizes state-of-the-art equipment. PLC-controlled equipment reduces human intervention and assures the high degree of reproducibility. Data acquisition instruments permit the collection and review of data to ensure high degree of process control. Zymet's control of its processes is well-respected. Customers that have developed their own proprietary compositions engage Zymet to toll manufacture their products.
Zymet is an ISO9001:2000 company. Its Quality System controls the processes of all aspects of its operations, from Design to Order Fullfillment. Performance of both our own processes and that of our suppliers is monitored. Continuous improvement is an established element of the system, to continually improve the consistency of our products and the performance of all aspects of our operations.
|Home | About | News | Products | Contact|
|© 2005-2012 by Zymet. All rights reserved.|