Underfill Encapsulants for Flip Chips
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to achieve the fast, void free encapsulation.
|Home | About | News | Products | Contact|
|©2005-2020 by Zymet. All rights reserved.|