Reworkable Edgebond Adhesives
For Ruggedization and Enhanced Thermal Cycle Performance
Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is reduced by the elimination of board preheat and capillary flow. Quality is improved because voids and incompatibility with flux residues are moot. Rework is far easier, further reducing cost. Zymet's reworkable edgebond adhesives provide all this, as they ruggedize and enhance the board level reliability of challenging electronic assemblies, even for enterprise and automotive applications.
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