Reworkable Edgebond Adhesives

For Ruggedization and Enhanced Thermal Cycle Performance

Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfills. Process cost is reduced by the elimination of board preheat and capillary flow. Quality is improved because voids and incompatibility with flux residues are moot. Rework is far easier, further reducing cost. Zymet's reworkable edgebond adhesives provide all this, as they ruggedize and enhance the board level reliability of challenging electronic assemblies, even for enterprise and automotive applications.

Features:

  • High Tg and Low CTE for the most challenging assemblies and applications
  • Fast, in-line curing with cure time as short as 1 minute
  • Moderate temperature cure
  • Long pot life
  • Excellent adhesion

Links to references:

  1. Edgebond Applied WLCSP Thermal Cycle Performance
  2. Reworkable Edgebond Applied WLCSP Thermal Cycling Performance Enhancement
  3. Underfills and Adhesives for Board Level Reliability
  4. Enhancing Mechanical Shock Performance Using Edgebond Technology
  5. High I/O BGA Connector Solder Joint Integrity Investigation
  6. A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day

 

For more information about specific applications and products, please Contact Us.


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