UV Curable Glob Top and Dam-and-Fill Encapsulants
For encapsulation of wirebonded IC’s
Zymet's glob top and dam-and-fill encapsulants are UV curable, yet they have properties similar to conventional heat cured encapsulants, high Tg’s and low CTE’s. With UV cure, curing is performed quickly, inline, at low temperatures, permitting the use of low cost substrates that cannot tolerate exposure to high temperatures. Applications include RFD and smartcard assembly, and coating of LCD driver IC's.
The encapsulants offer the following features:
For more information about specific applications and products, please Contact Us.
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