Electrically Conductive Adhesives
For die attach and general electronics assembly
Die Attach Adhesives
Zymet's electrically conductive die attach adhesives for semiconductor package assembly, hybrid IC assembly, COB IC assembly, and smartcard IC assembly. The adhesives are syringe dispensable pastes.
Features of Zymet's die attach adhesives include:
General Purpose Adhesives
Zymet’s general purpose electrically conductive adhesives are used for component attach, wire attach, and printed circuit assembly repair. The products are available as one-component versions, with excellent shelf stability and pot life, and as two-component versions capable of curing at room temperature. They range from being soft pastes that are easily dispensed to viscous pastes with high green strength.
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