Reworkable Edgebond Adhesives

For Ruggedization and Enhanced Thermal Cycle Performance

Edgebond adhesives, sometimes referred to as Corner Glues or Cornerbond Adhesives, are an excellent alternative to board-level underfill encapsulants. Process cost savings are achieved by the elimination of a capillary flow step. And, rework is far easier and quicker because the adhesive only needs to be removed from the edges of a component. Zymet's edgebond adhesives are designed to both ruggedize electronics and enhance their thermal cycle performance.

Reworkable process

Higher Tg, lower CTE versions are available that provide superior thermal cycle performance.

Features:

  • Ruggedization of electronics
  • Enhancement of thermal cycle performance
  • Curing in as little as 1 minute
  • Moderate temperature cure
  • Long pot life
  • Excellent adhesion to rigid boards and flexible circuitry

Links to references:

  1. Edgebond Applied WLCSP Thermal Cycle Performance
  2. Reworkable Edgebond Applied WLCSP Thermal Cycling Performance Enhancement
  3. Underfills and Adhesives for Board Level Reliability
  4. Enhancing Mechanical Shock Performance Using Edgebond Technology
  5. High I/O BGA Connector Solder Joint Integrity Investigation
  6. A Selected Comparison from ATC Test: Industry Progress from 2005 to Present Day

 

For more information about specific applications and products, please Contact Us.


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