Non-Conductive Pastes (NCP)

For flip chip attachment of RFID and smartcard IC’s

Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applications. To facilitate high-speed assembly, these adhesives can be cured at moderate temperature is as little as 5 seconds.

Features of Zymet's NCP’s include:

  • Curing in as little as 5 seconds
  • Moderate temperature cure
  • Excellent adhesion to organic substrates, including polyimide and PET
  • Excellent performance in bending tests
  • Excellent resistance to 85ºC/85% RH
  • Syringe dispensable or stencilable
  • Long pot life

For more information about specific applications and products, please Contact Us.


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